Work function metal patterning for nanosheet CFETs

ABSTRACT

Semiconductor devices, and methods of forming the same, include forming a stack of channel layers, including an upper device region and a lower device region. The upper device region is separated from the lower device region by a dielectric spacer layer. A first work function metal layer is formed on the channel layers in the lower device region. A height of the first work function metal layer does not rise above the dielectric spacer layer. A second work function metal layer is formed on the channel layers in the upper device region.

BACKGROUND

The present invention generally relates to semiconductor devicefabrication, and, more particularly, to the fabrication of nanosheetcomplementary field effect transistors (CFETs) with improved workfunction metal patterning.

As device size continues to decrease, and substantial improvements tophotolithographic technologies become more difficult to obtain,opportunities for increasing device density become more rare. Oneapproach is to stack devices, in particular in cases where the stackeddevices are functionally related. For example, CFETs can use devices oftwo different polarities, for example an n-type FET and a p-type FET, tohandle a single input signal. If the input signal is high, one of thedevices is activated, but if the input signal is low, the other of thedevices is activated.

However, it is difficult to form stacked CFETs. Different FET structuresmay be stacked, but all suffer from challenges, for example having poorpower efficiency, poor structural stability, and/or difficultfabrication processes.

SUMMARY

A method of forming a semiconductor device includes forming a stack ofchannel layers, including an upper device region and a lower deviceregion. The upper device region is separated from the lower deviceregion by a dielectric spacer layer. A first work function metal layeris formed on the channel layers in the lower device region. A height ofthe first work function metal layer does not rise above the dielectricspacer layer. A second work function metal layer is formed on thechannel layers in the upper device region.

A method of forming a semiconductor device includes forming a stack ofnanosheet semiconductor channel layers, including an upper device regionand a lower device region. The upper device region is separated from thelower device region by a dielectric spacer layer. Lower source/drainregions, having a first conductivity type, are formed on sidewalls ofthe channel layers in the lower device region. Upper source/drainregions, having a second conductivity type that is different from thefirst conductivity type, are formed on sidewalls of the channel layersin the upper device region. A first work function metal layer, havingthe first conductivity type, is formed on the channel layers in thelower device region. A height of the first work function metal layerdoes not rise above the dielectric spacer layer. A second work functionmetal layer, having the second conductivity type, is formed on thechannel layers in the upper device region.

A semiconductor device includes a stack of channel layers, including anupper device region and a lower device region. The upper device regionis separated from the lower device region by a dielectric spacer layer.A first work function metal layer is formed on the channel layers in thelower device region. A height of the first work function metal layerdoes not rise above the dielectric spacer layer. A second work functionmetal layer is formed on the channel layers in the upper device region.

These and other features and advantages will become apparent from thefollowing detailed description of illustrative embodiments thereof,which is to be read in connection with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The following description will provide details of preferred embodimentswith reference to the following figures wherein:

FIG. 1 is a top-down view of a fin and dummy gates for the formation ofnanosheet complementary field effect transistors (CFETs) with improvedwork function metal patterning, that defines cross-sectional planes inaccordance with an embodiment of the present invention;

FIG. 2 is a cross-sectional view of a step in the formation of nanosheetCFETs with improved work function metal patterning, showing a stack oflayers of channel material and two different sacrificial materials, inaccordance with an embodiment of the present invention;

FIG. 3 is a cross-sectional view of a step in the formation of nanosheetCFETs with improved work function metal patterning, showing thepatterning of a fin from the stack of layers, in accordance with anembodiment of the present invention;

FIG. 4 is a set of cross-sectional views of a step in the formation ofnanosheet CFETs with improved work function metal patterning, showingthe formation of dummy gates over the fin, in accordance with anembodiment of the present invention;

FIG. 5 is a set of cross-sectional views of a step in the formation ofnanosheet CFETs with improved work function metal patterning, showingthe removal of one set of sacrificial layers to form gaps in the fin, inaccordance with an embodiment of the present invention;

FIG. 6 is a set of cross-sectional views of a step in the formation ofnanosheet CFETs with improved work function metal patterning, showingthe formation of a dielectric spacer layer in the gaps to separate anupper device region from a lower device region, in accordance with anembodiment of the present invention;

FIG. 7 is a set of cross-sectional views of a step in the formation ofnanosheet CFETs with improved work function metal patterning, showingthe anisotropic etch of the fin in areas that are not covered by thedummy gates, in accordance with an embodiment of the present invention;

FIG. 8 is a set of cross-sectional views of a step in the formation ofnanosheet CFETs with improved work function metal patterning, showingthe formation of a lower source/drain region, in accordance with anembodiment of the present invention;

FIG. 9 is a set of cross-sectional views of a step in the formation ofnanosheet CFETs with improved work function metal patterning, showingthe formation of an isolation layer over the lower source/drain region,in accordance with an embodiment of the present invention;

FIG. 10 is a set of cross-sectional views of a step in the formation ofnanosheet CFETs with improved work function metal patterning, showingthe formation of an upper source/drain region, in accordance with anembodiment of the present invention;

FIG. 11 is a set of cross-sectional views of a step in the formation ofnanosheet CFETs with improved work function metal patterning, showingthe removal of the dummy gates, in accordance with an embodiment of thepresent invention;

FIG. 12 is a set of cross-sectional views of a step in the formation ofnanosheet CFETs with improved work function metal patterning, showingthe formation of a gate dielectric layer, in accordance with anembodiment of the present invention;

FIG. 13 is a set of cross-sectional views of a step in the formation ofnanosheet CFETs with improved work function metal patterning, showingformation of a first work function metal layer, in accordance with anembodiment of the present invention;

FIG. 14 is a set of cross-sectional views of a step in the formation ofnanosheet CFETs with improved work function metal patterning, showingthe etch back of the first work function metal layer in the upper deviceregion, in accordance with an embodiment of the present invention;

FIG. 15 is a set of cross-sectional views of a step in the formation ofnanosheet CFETs with improved work function metal patterning, showing ablocking layer being reformed around the lower device region and theremoval of remaining portions of the first work function metal layerfrom the upper device region, in accordance with an embodiment of thepresent invention;

FIG. 16 is a set of cross-sectional views of a step in the formation ofnanosheet CFETs with improved work function metal patterning, showingthe formation of a second work function metal layer, in accordance withan embodiment of the present invention;

FIG. 17 is a set of cross-sectional views of a step in the formation ofnanosheet CFETs with improved work function metal patterning, showingthe formation of conductive contacts, in accordance with an embodimentof the present invention;

FIG. 18 is a block/flow diagram of a method of forming nanosheet CFETswith improved work function metal patterning, in accordance with anembodiment of the present invention.

DETAILED DESCRIPTION

Embodiments of the present invention provide nanosheet complementaryfield effect transistors (CFETs) that have improved work function metalpatterning. Nanosheet devices are selected herein to provide good powerefficiency and structural stability. However, the fabrication of stackednanosheet CFETs is challenging, due to the difficulty of selectivelymasking the devices. The close proximity of the upper device to thelower device can cause the masking material to pinch off andincompletely fill the space between the two devices. Then, when theupper device is processed, the incomplete mask can result in damage tothe lower device, decreasing device yield. This is due to the relativelylarge width of nanosheet channels, which makes it difficult for the maskmaterial to fill in completely.

The present embodiments make use of a sacrificial layer between theupper device and the lower device. This sacrificial layer creates agreater distance between the lowest channel layer of the upper deviceand the highest channel layer of the lower device. The sacrificial layercan then be used to help completely mask the lower device while theupper device is being processed, for example for the deposition of adifferent work function metal.

Referring now to the drawings in which like numerals represent the sameor similar elements and initially to FIG. 1 , a top-down view of adevice is shown. This view establishes three different cross-sectionalplanes: X indicates a cross-sectional view that cuts transversely acrossa fin 102, and longitudinally along a gate structure 104, Y indicates across-sectional view that cuts longitudinally along the fin 102, andtransversely across the gate structure 104, and Z indicates across-sectional view that cuts transversely across the fin 102, betweenadjacent gate structures 104. The following figures will show bothviews, side by side, to illustrate a step-by-step process for formingnanosheet CFETs according to the present embodiments. It should beunderstood that the present figures are not drawn to a realistic scale,nor are they intended to represent a consistent scale between thefigures.

Referring now to FIG. 2 , a cross-sectional view of a step in thefabrication of nanosheet CFETs is shown. A stack of semiconductor layersis formed on a semiconductor substrate 202. The semiconductor layersinclude channel layers 204, first sacrificial layers 206, and secondsacrificial layers 208. It is specifically contemplated that eachsuccessive layer may be epitaxially grown from the previous layer, butit should be understood that other methods of deposition may be employedinstead. A hardmask layer 210 is formed over the stack from anyappropriate hardmask material, such as silicon nitride. The layersdefine a lower device region 210 and an upper device region 220, formedfrom respective sets of channel layers 204.

The semiconductor substrate 102 may be a bulk-semiconductor substrate.In one example, the bulk-semiconductor substrate may be asilicon-containing material. Illustrative examples of silicon-containingmaterials suitable for the bulk-semiconductor substrate include, but arenot limited to, silicon, silicon germanium, silicon germanium carbide,silicon carbide, polysilicon, epitaxial silicon, amorphous silicon, andmulti-layers thereof. Although silicon is the predominantly usedsemiconductor material in wafer fabrication, alternative semiconductormaterials can be employed, such as, but not limited to, germanium,gallium arsenide, gallium nitride, cadmium telluride, and zinc selenide.Although not depicted in the present figures, the semiconductorsubstrate 102 may also be a semiconductor on insulator (SOI) substrate.

As noted above, the semiconductor layers may be epitaxially grown fromthe semiconductor substrate. The terms “epitaxial growth” means thegrowth of a semiconductor material on a deposition surface of asemiconductor material, in which the semiconductor material being grownhas substantially the same crystalline characteristics as thesemiconductor material of the deposition surface. The term “epitaxialmaterial” denotes a material that is formed using epitaxial growth. Insome embodiments, when the chemical reactants are controlled and thesystem parameters set correctly, the depositing atoms arrive at thedeposition surface with sufficient energy to move around on the surfaceand orient themselves to the crystal arrangement of the atoms of thedeposition surface. Thus, in some examples, an epitaxial film depositedon a {100} crystal surface will take on a {100} orientation.

In embodiments where the semiconductor substrate 102 is formed fromsilicon, the semiconductor layers can be formed from silicon or silicongermanium, which can be selectively etched with respect to one another,and which have compatible crystal structures. In some embodiments, thechannel layers 204 can be formed from silicon, the first sacrificiallayers 206 can be formed from silicon germanium at a first germaniumconcentration, and the second sacrificial layers 208 can be formed fromsilicon germanium at a second germanium concentration. In someembodiments, the first sacrificial layers 206 may have a germaniumconcentration of about 35%, and the second sacrificial layers 208 mayhave a germanium concentration of about 65%, but it should be understoodthat these concentrations are purely exemplary and should not beconsidered to be limiting.

The germanium concentration in silicon germanium controls how rapidlythe layer can be removed under certain etches, making these layersselectively etchable with respect to one another. As used herein, theterm “selective” in reference to a material removal process denotes thatthe rate of material removal for a first material is greater than therate of removal for at least another material of the structure to whichthe material removal process is being applied.

Referring now to FIG. 3 , a cross-sectional view of a step in thefabrication of nanosheet CFETs is shown. The mask layer 210 is patternedusing any appropriate process, for example using a photolithographicprocess or sidewall image transfer. One or more anisotropic etches arethen used to etch down into the stack of semiconductor layers, stoppingat the semiconductor substrate 202, to form a fin 302 of stackedsemiconductor layers. The anisotropic etches can include, for example,reactive ion etching (RIE). After formation of the fins 302, the regionsaround the fins can be replaced with shallow trench isolation (STI)structures 304. The STI structures can be formed by, e.g., etchingtrenches into the semiconductor substrate 202, followed by deposition ofan STI material, such as a silicon oxide. After that, the hardmask layer210 can then be selectively etched away, using any appropriate selectiveetch. It is specifically contemplated that the fin 302 can be patternedto form nanosheets from the stacked semiconductor layers. As usedherein, the term “nanosheet” is used to denote a structure that has awidth-to-height ratio on the X cross-section that is at least 2:1.

RIE is a form of plasma etching in which during etching the surface tobe etched is placed on a radio-frequency powered electrode. Moreover,during RIE the surface to be etched takes on a potential thataccelerates the etching species extracted from plasma toward thesurface, in which the chemical etching reaction is taking place in thedirection normal to the surface. Other examples of anisotropic etchingthat can be used at this point of the present invention include ion beametching, plasma etching or laser ablation.

Referring now to FIG. 4 , a set of cross-sectional views of a step inthe fabrication of nanosheet CFETs are shown. Dummy gates 402 are formedover the fin 302. A layer of dummy gate material, such as a thin layerof oxide followed by polycrystalline silicon, is deposited over the fins302. A hardmask 404 is then formed by any appropriate process, such as aphotolithographic process or a sidewall image transfer process. Thedummy gates 402 can then be formed by selectively and anisotropicallyetching the dummy gate material around the hardmask 404.

Referring now to FIG. 5 , a set of cross-sectional views of a step inthe fabrication of nanosheet CFETs are shown. The second sacrificiallayers 208 are selectively etched away, leaving the channel layers 204and the first sacrificial layers 206. The resulting gaps 502 separatethe lower device region 210 from the upper device region 220. Inembodiments that use silicon germanium for the sacrificial layers, thehigher concentration in the second sacrificial layers 208 results in theetch of these layers proceeding much faster than for the firstsacrificial layers 206 and the channel layers 202.

Referring now to FIG. 6 , a set of cross-sectional views of a step inthe fabrication of nanosheet CFETs are shown. Spacer material isconformally deposited to fill the gaps 502 to form middle spacer 602,bottom spacer 604, and dummy gate spacers 606. The spacer material canbe masked and anisotropically etched, as appropriate, to preserve thedummy gate spacers 606 while removing the spacer material from thesidewalls of the fins 302. It is specifically contemplated that thespacer material can be distinct from the material of the hardmasks 404,and that the two materials may be selectively etchable with respect toone another. For example, one material may be formed from siliconnitride, while the other may be formed from SiOCN.

Referring now to FIG. 7 , a set of cross-sectional views of a step inthe fabrication of nanosheet CFETs are shown. The fins 302 are etchedaway in the regions between the dummy gates, leaving the bottom spacer604 in that region intact. A series of selective anisotropic etches canbe used to remove the different layers. The first sacrificial layers 206can be recessed relative to the channel layers 204, and inner spacers702 can be formed in the recesses.

The formation of inner spacers 702 can be performed in a variety ofways. In some embodiments, a selective etch can be used to recess thefirst sacrificial layers 206. A layer of dielectric material, such assilicon nitride, can then be conformally deposited to fill the recesses,and material outside the protection of the recesses can be isotropicallyetched away. In other embodiments, a condensation process can be used toselectively oxidize the end surfaces of the first sacrificial layers206, which draws silicon out of silicon germanium to form silicondioxide.

Referring now to FIG. 8 , a set of cross-sectional views of a step inthe fabrication of nanosheet CFETs are shown. Lower source/drain regions802, for the lower device 210, are epitaxially grown from sidewalls ofthe channel layers 204. After the epitaxial material is grown, anyepitaxial material formed over top nanosheets is etched back, below theheight of the middle spacer 602. Additionally, the epitaxial materialcan be masked and etched down to the underlying STI 304 for the portionwhere it is not needed.

The lower source/drain regions 802 can be doped in situ during epitaxialgrowth, or by an ion implantation process. The dopants used for thelower source/drain regions 802 will belong to a first dopantconductivity type. As used herein, the term “conductivity type” denotesa dopant region being p-type or n-type. As used herein, “p-type” refersto the addition of impurities to an intrinsic semiconductor that createsdeficiencies of valence electrons. In a silicon-containing substrate,examples of p-type dopants, i.e., impurities, include but are notlimited to: boron, aluminum, gallium and indium. As used herein,“n-type” refers to the addition of impurities that contributes freeelectrons to an intrinsic semiconductor. In a silicon containingsubstrate, examples of n-type dopants, i.e., impurities, include but arenot limited to antimony, arsenic and phosphorous. In some embodiments,the lower source/drain regions 802 may therefore be either n-type orp-type.

Referring now to FIG. 9 , a set of cross-sectional views of a step inthe fabrication of nanosheet CFETs are shown. An isolation layer 902 isdeposited to a height that exceeds the height of the middle spacer layer602, while leaving the channel layers 204 of the upper device region 220exposed. The isolation layer 902 can be formed from any appropriatedielectric material, for example silicon dioxide or a low-k dielectricmaterial. As used herein, the term “low-k” refers to a material that hasa dielectric constant k that is lower than the dielectric constant ofsilicon dioxide. Low-k materials can be used to minimize parasiticcapacitances. One way to form 902 is to overfill the space with 902first, CMP, and recess to the level, such that top nanosheets arerevealed while bottom epitaxial material is still covered by 902.

Referring now to FIG. 10 , a set of cross-sectional views of a step inthe fabrication of nanosheet CFETs are shown. Upper source/drain regions1002 are epitaxially grown from exposed sidewalls of the channel layers204 in the upper device region 220. Additional dielectric material isdeposited around the upper source/drain regions 1002, for example formedfrom the same material as the isolation layer 902, to extend theisolation layer 1004. The dielectric material can then be polished downto the level of the hardmasks 404 using, e.g., a chemical mechanicalplanarization (CMP) process.

CMP is performed using, e.g., a chemical or granular slurry andmechanical force to gradually remove upper layers of the device. Theslurry may be formulated to be unable to dissolve, for example, thedummy gates 402, resulting in the CMP process's inability to proceed anyfarther than that layer.

Whereas the lower source/drain regions 802 were formed from a firstconductivity type, the upper source/drain regions 1002 may be formedfrom a second, opposite conductivity type. In this manner, a CFET can beformed, for example with a p-type FET on the bottom and an n-type FET atthe top.

The upper source/drain regions 1002 can be patterned and etched, withsome lateral displacement between the position of the lower source/drainregions 802 and the upper source/drain regions 1002. This leaves roomfor the formation of conductive contacts, down through the isolationlayer 1004, to reach the lower source/drain regions 802.

Referring now to FIG. 11 , a set of cross-sectional views of a step inthe fabrication of nanosheet CFETs are shown. The dummy gates 402 areselectively etched away, followed by the first sacrificial layers 206.The latter etch in particular can be performed with a selectiveisotropic etch, which removes the sacrificial material from between thechannel layers 204. This forms a gap 1102 where the sacrificial layerswere, including space between vertically adjacent channel layers 204.

Referring now to FIG. 12 , a set of cross-sectional views of a step inthe fabrication of nanosheet CFETs are shown. A gate dielectric 1202 isformed in the gaps 1102, for example by a conformal deposition process.The gate dielectric 1202 adheres to the surfaces of the channel layers204, including in the spaces between the channel layers 204. In someembodiments, the gate dielectric layer 1202 may be chamfered, bypartially filling the gaps 1102 with a sacrificial material and etchingback the portions of the gate dielectric material that remain exposed.The sacrificial material can then be etched away.

The gate dielectric 1202 can be formed from any appropriate dielectricmaterial, but it is specifically contemplated that a high-k dielectricmaterial may be used. As used herein, the term “high-k” refers to amaterial that has a dielectric constant k that is greater than thedielectric constant of silicon dioxide. Examples of high-k dielectricmaterials include but are not limited to metal oxides such as hafniumoxide, hafnium silicon oxide, hafnium silicon oxynitride, lanthanumoxide, lanthanum aluminum oxide, zirconium oxide, zirconium siliconoxide, zirconium silicon oxynitride, tantalum oxide, titanium oxide,barium strontium titanium oxide, barium titanium oxide, strontiumtitanium oxide, yttrium oxide, aluminum oxide, lead scandium tantalumoxide, and lead zinc niobate. The high-k material may further includedopants such as lanthanum and aluminum.

Referring now to FIG. 13 , a set of cross-sectional views of a step inthe fabrication of nanosheet CFETs are shown. A first work functionmetal layer 1302 is conformally deposited in the gap 1102, particularlyin the spaces between the channel layers 204. Notably, the first workfunction metal layer 1302 need not necessarily pinch off in the spacesbetween the channel layers 204, and additional conductive material mayfilled into any remaining gaps in such embodiments.

The first work function metal layer 1302 may be formed from either ap-type or n-type work function metal. As used herein, a “p-type workfunction metal” is a metal that effectuates a p-type threshold voltageshift. In one embodiment, the work function of the p-type work functionmetal layer ranges from 4.9 eV to 5.2 eV. As used herein, “thresholdvoltage” is the lowest attainable gate voltage that will turn on asemiconductor device, e.g., transistor, by making the channel of thedevice conductive. The term “p-type threshold voltage shift” as usedherein means a shift in the Fermi energy of a p-type semiconductordevice towards a valence band of silicon in the silicon containingsubstrate of the p-type semiconductor device. A “valence band” is thehighest range of electron energies where electrons are normally presentat absolute zero. In one embodiment, a p-type work function metal layermay be formed from titanium nitride, titanium aluminum nitride,ruthenium, platinum, molybdenum, cobalt, and alloys and combinationsthereof.

As used herein, an “n-type work function metal” is a metal layer thateffectuates an n-type threshold voltage shift. “N-type threshold voltageshift” as used herein means a shift in the Fermi energy of an n-typesemiconductor device towards a conduction band of silicon in asilicon-containing substrate of the n-type semiconductor device. The“conduction band” is the lowest lying electron energy band of the dopedmaterial that is not completely filled with electrons. In oneembodiment, the work function of the n-type work function metal layerranges from 4.1 eV to 4.3 eV. In one embodiment, the n-type workfunction metal layer is formed from at least one of titanium aluminum,tantalum nitride, titanium nitride, hafnium nitride, hafnium silicon, orcombinations thereof. It should be understood that titanium nitride mayplay the role of an n-type work function metal or a p-type work functionmetal, depending on the conditions of its deposition.

The conductivity type of the first work function metal layer 1302 isselected to match the conductivity type of the lower source/drain region802. Thus, if the lower source/drain region 802 is doped with a p-typedopant, then a p-type work function metal is selected for the first workfunction metal layer 1302. Similarly, if the lower source/drain region802 is doped with an n-type dopant, then an n-type work function metallayer is selected.

Referring now to FIG. 14 , a set of cross-sectional views of a step inthe fabrication of nanosheet CFETs are shown. A first sacrificial layer1402 can be deposited around the first work function layer 1302 and thenetched back. The height of the sacrificial layer can be at a levelaround the height of the middle spacer 602. The exposed portions of thefirst work function metal layer 1302 can then be etched back using anisotropic etch. The etch is stopped to prevent overetching the materialin the lower device region 210, which results in some work functionmetal remaining between the channel layers 204 of the upper deviceregion 220.

The first sacrificial layer 1402 may be an organic planarizing layer(OPL) and can include an organic polymer that, when exposed toelectromagnetic (EM) radiation, changes chemically to be removable by adeveloping solvent. Examples of organic polymers may includepolyacrylate resin, epoxy resin, phenol resin, polyamide resin,polyimide resin, unsaturated polyester resin, polyphenylenether resin,polyphenylenesulfide resin, or benzocyclobutene. More generally, thefirst sacrificial layer 1402 may be formed from any organic polymer anda compound having a molecular structure that can attach to the molecularstructure of the organic polymer. The first sacrificial layer 1402 may,for example, be applied using spin coating technology or a flowable CVDprocess.

Referring now to FIG. 15 , a set of cross-sectional views of a step inthe fabrication of nanosheet CFETs are shown. The first sacrificiallayer 1402 is selectively removed, for example by ashing the OPLmaterial, and a second sacrificial layer 1502 is formed. The secondsacrificial layer 1502 has a height at least as high as the bottomsurface of the middle spacer 602. The portions of the first workfunction material that remained between the channel layers 204 of theupper device region 220 can then be selectively removed using anaggressive isotropic etch, without damaging the first work functionmetal layer 1302 in the lower device region 210.

Referring now to FIG. 16 , a set of cross-sectional views of a step inthe fabrication of nanosheet CFETs are shown. A second work functionmetal layer 1602 is conformally deposited, filling the spaces betweenthe channel layers 204 of the upper device region 220. Because theeffect of the work function metals is achieved by contact with thechannel, electrical contact between the first work function metal layer1302 and the second work function metal layer 1602 is permissible. Thesecond work function metal layer 1602 can be chamfered by filling in asacrificial material, etching back exposed portions of the second workfunction metal, and removing the sacrificial material. The material ofthe second work function metal layer 1602 is selected to match theconductivity type with the upper source/drain regions 1002, and to havean opposite conductivity type as compared to the conductivity type ofthe first work function metal layer 1302.

Referring now to FIG. 17 , a set of cross-sectional views of a step inthe fabrication of nanosheet CFETs are shown. A gate contact 1702 isformed over the second work function metal layer 1602. Vias are formedin the isolation layer 1004 and conductive material is deposited to formlower source/drain regions 1704 and upper source/drain regions 1706.These contacts can be formed from any appropriate conductive material.Exemplary conductive materials may include, e.g., tungsten, nickel,titanium, molybdenum, tantalum, copper, platinum, silver, gold,ruthenium, iridium, rhenium, rhodium, cobalt, and alloys thereof.Alternatively, a doped semiconductor material may be used, such as,e.g., doped polysilicon.

It is to be understood that aspects of the present invention will bedescribed in terms of a given illustrative architecture; however, otherarchitectures, structures, substrate materials and process features andsteps can be varied within the scope of aspects of the presentinvention.

It will also be understood that when an element such as a layer, regionor substrate is referred to as being “on” or “over” another element, itcan be directly on the other element or intervening elements can also bepresent. In contrast, when an element is referred to as being “directlyon” or “directly over” another element, there are no interveningelements present. It will also be understood that when an element isreferred to as being “connected” or “coupled” to another element, it canbe directly connected or coupled to the other element or interveningelements can be present. In contrast, when an element is referred to asbeing “directly connected” or “directly coupled” to another element,there are no intervening elements present.

The present embodiments can include a design for an integrated circuitchip, which can be created in a graphical computer programming language,and stored in a computer storage medium (such as a disk, tape, physicalhard drive, or virtual hard drive such as in a storage access network).If the designer does not fabricate chips or the photolithographic masksused to fabricate chips, the designer can transmit the resulting designby physical means (e.g., by providing a copy of the storage mediumstoring the design) or electronically (e.g., through the Internet) tosuch entities, directly or indirectly. The stored design is thenconverted into the appropriate format (e.g., GDSII) for the fabricationof photolithographic masks, which typically include multiple copies ofthe chip design in question that are to be formed on a wafer. Thephotolithographic masks are utilized to define areas of the wafer(and/or the layers thereon) to be etched or otherwise processed.

Methods as described herein can be used in the fabrication of integratedcircuit chips. The resulting integrated circuit chips can be distributedby the fabricator in raw wafer form (that is, as a single wafer that hasmultiple unpackaged chips), as a bare die, or in a packaged form. In thelatter case, the chip is mounted in a single chip package (such as aplastic carrier, with leads that are affixed to a motherboard or otherhigher level carrier) or in a multichip package (such as a ceramiccarrier that has either or both surface interconnections or buriedinterconnections). In any case, the chip is then integrated with otherchips, discrete circuit elements, and/or other signal processing devicesas part of either (a) an intermediate product, such as a motherboard, or(b) an end product. The end product can be any product that includesintegrated circuit chips, ranging from toys and other low-endapplications to advanced computer products having a display, a keyboardor other input device, and a central processor.

It should also be understood that material compounds will be describedin terms of listed elements, e.g., SiGe. These compounds includedifferent proportions of the elements within the compound, e.g., SiGeincludes Si_(x)Ge_(1-x) where x is less than or equal to 1, etc. Inaddition, other elements can be included in the compound and stillfunction in accordance with the present principles. The compounds withadditional elements will be referred to herein as alloys.

Reference in the specification to “one embodiment” or “an embodiment”,as well as other variations thereof, means that a particular feature,structure, characteristic, and so forth described in connection with theembodiment is included in at least one embodiment. Thus, the appearancesof the phrase “in one embodiment” or “in an embodiment”, as well anyother variations, appearing in various places throughout thespecification are not necessarily all referring to the same embodiment.

It is to be appreciated that the use of any of the following “/”,“and/or”, and “at least one of”, for example, in the cases of “A/B”, “Aand/or B” and “at least one of A and B”, is intended to encompass theselection of the first listed option (A) only, or the selection of thesecond listed option (B) only, or the selection of both options (A andB). As a further example, in the cases of “A, B, and/or C” and “at leastone of A, B, and C”, such phrasing is intended to encompass theselection of the first listed option (A) only, or the selection of thesecond listed option (B) only, or the selection of the third listedoption (C) only, or the selection of the first and the second listedoptions (A and B) only, or the selection of the first and third listedoptions (A and C) only, or the selection of the second and third listedoptions (B and C) only, or the selection of all three options (A and Band C). This can be extended, as readily apparent by one of ordinaryskill in this and related arts, for as many items listed.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of exampleembodiments. As used herein, the singular forms “a,” “an” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“comprises,” “comprising,” “includes” and/or “including,” when usedherein, specify the presence of stated features, integers, steps,operations, elements and/or components, but do not preclude the presenceor addition of one or more other features, integers, steps, operations,elements, components and/or groups thereof.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” and the like, can be used herein for ease of description todescribe one element's or feature's relationship to another element(s)or feature(s) as illustrated in the FIGS. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the FIGS. For example, if the device in theFIGS. is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the term “below” can encompass both an orientation ofabove and below. The device can be otherwise oriented (rotated 90degrees or at other orientations), and the spatially relativedescriptors used herein can be interpreted accordingly. In addition, itwill also be understood that when a layer is referred to as being“between” two layers, it can be the only layer between the two layers,or one or more intervening layers can also be present.

It will be understood that, although the terms first, second, etc. canbe used herein to describe various elements, these elements should notbe limited by these terms. These terms are only used to distinguish oneelement from another element. Thus, a first element discussed belowcould be termed a second element without departing from the scope of thepresent concept.

Referring now to FIG. 18 , a method of forming nanosheet CFETs is shown.Block 1802 forms a stack of semiconductor layers on a semiconductorsubstrate 202. The semiconductor layers include channel layers 204,first sacrificial layers 206, and second sacrificial layers 208, and itis specifically contemplated that the stack may be formed by epitaxiallygrowing each new layer from the top surface of the previous layer. Block1804 masks and anisotropically etches the stack of layers to form a fin302. Block 1806 forms STI regions around the fin 302, for example byforming trenches in the semiconductor substrate 202 and then filling thetrenches with an electrically insulating material.

Block 1808 forms dummy gates 402 over the fins 302. Block 1810 etchesaway the second sacrificial layers 208 using a selective isotropic etch,and then block 1812 forms spacer layers 602 and 604 in the gaps in theresulting fins 302. Block 1813 forms spacers 606 on the sidewalls of thedummy gates 404, for example in the same deposition process that formsthe intra-fin spacers. Block 1814 anisotropically etches the fin 302 inthe exposed regions around the dummy gates 402 and the dummy gatesidewall spacers 606. Block 1815 recesses the first sacrificial layers206 and forms inner spacers 702 in the recesses.

Block 1816 forms lower source/drain regions 802, for example byepitaxially growing these structures from the exposed side surfaces ofthe channel layers 204. The resulting structure can be etched back tothe lower device region 210, and can furthermore be patterned to anappropriate shape. Block 1818 forms an isolation layer over and aroundthe lower source/drain regions 802. Block 1820 forms upper source/drainregions 1002, for example by epitaxial growth from the exposed sidesurfaces of the channel layers 204 in the upper device region 220. Block1822 extends forms additional isolation layer 1004 to cover the uppersource/drain regions 1002. In some embodiments, these source/drainregions can be doped in situ or by ion implantation, and the dopantconductivity types of the respective source/drain regions may beopposite to one another.

Block 1824 etches away the dummy gate 1824, thereby exposing thesurfaces of the channel layers 204. Block 1826 forms a gate dielectriclayer 1202 by conformal deposition on these exposed surfaces. Block 1828deposits a first work function metal layer 1302 over, around, andbetween the channel layers 204 and the middle spacer 602. Block 1830forms a first sacrificial layer 1402 around the fins 302, and block 1832then partially etches back the first work function metal layer 1302. Thefirst sacrificial layer 1402 is removed in block 1834 and is replacedwith second sacrificial layer 1502, which protects the first workfunction metal layer 1302 from subsequent etches. Block 1836 fullyetches away remaining first work function metal from between the channellayers 204 in the upper device region 220. Block 1838 then forms secondwork function metal layer 1602 over, around, and between the channellayers 204 of the upper device region 220. Block 1840 forms contacts tofinish the device.

Having described preferred embodiments of work function metal patterningfor nanosheet CFETs (which are intended to be illustrative and notlimiting), it is noted that modifications and variations can be made bypersons skilled in the art in light of the above teachings. It istherefore to be understood that changes may be made in the particularembodiments disclosed which are within the scope of the invention asoutlined by the appended claims.

What is claimed is:
 1. A method of forming a semiconductor device,comprising: forming a stack of channel layers, including an upper deviceregion and a lower device region, wherein the upper device region isseparated from the lower device region by a dielectric spacer layer;forming a first work function metal layer on the channel layers in thelower device region, wherein a height of the first work function metallayer does not rise above the dielectric spacer layer, including forminga first sacrificial layer around the first work function metal layerbefore partially etching the first work function metal, removing thefirst sacrificial layer after partially etching the first work functionmetal, forming a second sacrificial layer before etching away remainingportions of the first work function metal layer in the upper deviceregion, and removing the second sacrificial layer after etching away theremaining portions of the first work function metal layer; and forming asecond work function metal layer on the channel layers in the upperdevice region and on the first work function metal layer in the lowerdevice region.
 2. The method of claim 1, further comprising forming agate dielectric layer on the channel layers and on the dielectric spacerlayer, before forming the first work function metal layer.
 3. The methodof claim 2, wherein the gate dielectric layer and the dielectric spacerlayer are formed from different dielectric materials.
 4. The method ofclaim 1, wherein forming the first work function metal layer comprises:conformally forming a first work function metal on the channel layers ofboth the upper device region and the lower device region; partiallyetching the first work function metal in the upper device region with anetch that exposes at least a portion of sidewalls of the dielectricspacer layer; and etching away remaining portions of the first workfunction metal from surfaces of the channel layers in the upper deviceregion.
 5. The method of claim 4, wherein the first sacrificial layer isformed to a height that does not exceed a top surface of the dielectricspacer.
 6. The method of claim 5, wherein the second sacrificial layeris formed to a height that does not reach a height of a lower surface ofthe channel layers of the upper device region.
 7. The method of claim 1,further comprising: forming lower source/drain regions on sidewalls ofthe channel layers in the lower device region; and forming uppersource/drain regions on sidewalls of the channel layers in the upperdevice region.
 8. The method of claim 7, wherein forming the lowersource/drain regions comprises: growing epitaxial material from exposedsidewalls of the channel layers; and etching the epitaxial material awayfrom the channel layers in the upper device region.
 9. The method ofclaim 7, wherein forming the upper source/drain regions comprises:growing epitaxial material from exposed sidewalls of the channel layersin only the upper device region; and patterning the epitaxial material,such that at least a portion of the lower source/drain regions has noepitaxial material over it.
 10. The method of claim 1, wherein formingthe stack of channel layers comprises: forming a stack of semiconductorlayers that include the channel layers, first sacrificial semiconductorlayers, and second sacrificial semiconductor layers; etching away thesecond sacrificial semiconductor layers to form a gap; forming thedielectric spacer layer in the gap; and etching away the firstsacrificial semiconductor layers.
 11. The method of claim 1, wherein thechannel layers are each nanosheet semiconductor layers.
 12. The methodof claim 1, wherein the first work function metal layer has a firstconductivity type, and the second work function metal layer has a secondconductivity type, different from the first conductivity type.
 13. Amethod of forming a semiconductor device, comprising: forming a stack ofnanosheet semiconductor channel layers, including an upper device regionand a lower device region, wherein the upper device region is separatedfrom the lower device region by a dielectric spacer layer; forming lowersource/drain regions, having a first conductivity type, on sidewalls ofthe channel layers in the lower device region; forming uppersource/drain regions, having a second conductivity type that isdifferent from the first conductivity type, on sidewalls of the channellayers in the upper device region; forming a first work function metallayer, having the first conductivity type, on the channel layers in thelower device region, wherein a height of the first work function metallayer does not rise above the dielectric spacer layer, including forminga first sacrificial layer around the first work function metal layerbefore partially etching the first work function metal, removing thefirst sacrificial layer after partially etching the first work functionmetal layer, forming a second sacrificial layer before etching awayremaining portions of the first work function metal layer in the upperdevice region, and removing the second sacrificial layer after etchingaway the remaining portions of the first work function metal layer; andforming a second work function metal layer, having the secondconductivity type, on the channel layers in the upper device region andon the first work function metal layer in the lower device region.